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Product Reliability

1、Product Reliability Testing Project

The whole series of products pass the reliability test of semiconductor power devices according to JEDEC and AEC101 standards

Test Iteam Description Test Condition Duration Ref.Standard
PC Pre-conditioning
Pre-test & V/M TMCL -> Bake Soak (MSL 1)
IR Reflow Post-test & V/M
Pre &Post- test JESD22-A113
ACLV(PCT) Autoclave(Pressure Cooker Test)
TA=121°C / 100%RH, Gauge Pressure 15 psig ;
Unbiased.
24/96 Hours JESD22-A102
HTSL High Temperature Storage Life
TA=150°C, or specified maximum storage
temperature.
168/500/1000 Hours JESD22-A103
RSH Resistance to Solder Heat
TA=260°C, 10 Sec. (for SMD)
TA=270°C, 7 Sec. (for Thr-Hole)
1 Cycle JESD22-A111
JESD22-B106
TMCL(TCH) Temperature Cycling
TA=-65°C to +150°C, dwell time 15min.
(30min/cycle), Air to air
100/500/1000 Cycles JESD22-A104
H3TRB(THB) High Humidity High Temperature Reverse Bias
TA=85°C, 85%RH, 80% of rated BV ; or up to a
maximum of 100V
168/500/1000 Hours JESD22-A101
HTRB High Temperature Reverse Bias
TA=150°C or specified max. Tj (T A is to be adjusted
to compensate for leakage ) , 80% of rated BV
168/500/1000 Hours JESD22-A108
HTGB High Temperature Gate Bias (for MOSFET only)
TA=150°C or specified max. T; (T A is to be adjusted
to compensate for leakage), 100% of rated VGS
168/500/1000 Hours JESD22-A108
OPL Operating Life
TA=25°C, max. power rating or powered to max. Tj 168/500/1000 Hours JESD22-A108
IOL Intermittent Operating Life
TA=25 0 C, ATj 2 100 〇 C, t 0N =t 0FF =2 min (or 3_5 min} 2520/7500/15000 Cycles MIL-STD-750
Method 1037


2、Product Reliability Test Report

Part Number Reliability Test Report
DT8T35I
DT12T35I
DT16T35I
DT4T10F
DT16T35E